Thermally Conductive Polyimide Film's thermal conductivity property combines the characteristic of hightemperature resistance makes it ideal product for usage in controlling and managing heat in electronic assemblies;
Characters:
Higher thermal conductivity
Halogen-free,environment-friendly.
Application:
Ceramic board replacement
Insulation pads (heat sink)
Thickness available:25um 38um 50um 75um 100um
(others are also available to be customized if needed)