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Thermally Conductive Polyimide Film

Basic Information

Material: :Polyimide
Thickness: : 0.25mm
Thermal Condu:≥0.36w/mk
Elongation::≥40%
Description

Thermally Conductive Polyimide Film's thermal conductivity property combines the characteristic of hightemperature resistance makes it ideal product for usage in controlling and managing heat in electronic assemblies;


Characters:

Higher thermal conductivity

Halogen-free,environment-friendly.


Application:

Ceramic board replacement

Insulation pads (heat sink)


Thickness available:25um 38um 50um 75um 100um

(others are also available to be customized if needed)

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